10" Resin Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron , 1/box, DIA-R015-10-PSA wb-0085hc 5-inch SiC Abrasive Wafering Blade

Name: 10" Resin Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron , 1/box, DIA-R015-10-PSA wb-0085hc 5-inch SiC Abrasive Wafering Blade
Brand: fazendadorosa.com.br
SKU: 19645303305
Price: 159.49 USD
Availability: InStock
Rating: 4.1782 (6 reviews)

SKU: 19645303305

4.2

USD159.49 USD188.49

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Ships within 48 hours · Estimated delivery Jul 30 - Aug 4

Description

5-inch SiC Abrasive Wafering Blade (0

1200 grit SiC Roll (3-7/16-inch

50 micron Diamond Lapping Film (plain-backed) (3/pkg)

Premium Glass Filled Epoxy-Phenolic edge retention compression mounting resin

10-inch 30 micron metal bonded Diamond Abrasive Grinding Disk with PSA backing (each)

10" Resin Bonded Diamond Abrasive Grinding Disk with PSA backing, 15 micron , 1/box, DIA-R015-10-PSA wb-0085hc 5-inch SiC Abrasive Wafering Blade10 inch 15 micron resin bonded Diamond Abrasive Grinding Disk with PSA backing (each)

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